3D IC Integrated Senior Expert

Huawei

  • Leuven, Vlaams Brabant
  • Vast
  • Voltijds
  • 1 maand geleden
Huawei’s vision is to enrich people's lives through communication. By leveraging our experience and expertise in the telecom sector, we help bridge the digital divide and give people the opportunity to join the information age, regardless of their geographic location.Huawei’s European Research Institute (ERI), headquartered in Leuven, comprises 18 sites in 12 countries where Huawei is performing advanced technical research in different fields in order to realize the vision of a world-leading research center for innovative technologies and platforms enabling the development of world-class products and solutions.Based in Leuven, Belgium, the head-quarter of the European Research Institute we are looking for a: 3D IC Integrated Senior ExpertThe responsibility includes:Participate in key chip projects in AI/CPU, mobile phone, network and other fields, and be responsible for the following aspects:
  • Output a competitive 3DIC engineering architecture according to the application scenarios and needs of the product.
  • Decompose the engineering structure into implementable engineering plans, identify and perform 3DIC risk management, and finally transform the technology Idea into commercial success.
  • Combined with the industry's best 3DIC engineering practice and industry analysis, carry out innovative research and industry-leading exchange of cutting-edge technology. Work with Vendor jointly to customize 3DIC technology suitable for HiSilicon, thus supporting HiSilicon to continuously be the lead in the 3DIC field.
Required Education and Experience:
  • More than 10 years of work experience in related companies in the industry, technical team leader or senior expert.
  • Having FAB work background, familiar with Wafer process, and has many successful 3DIC experience.
  • The background and experience of Wafer Process Integration are required. And it’s best to have the experience covering any of the two items: 1) BEOL Process Integration; 2) Wafer Level Package Process Integration; 3) 2.5D Interposer/3DIC process integration including TSV Process, Chip to Wafer Process, wafer to wafer process, etc.
  • Good teamwork ability, good communication skills. Excellent analytical skills.
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Huawei